Please use this identifier to cite or link to this item: http://hdl.handle.net/11401/65471
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dc.contributor.authorLi, Taoen_US
dc.contributor.authorZemanian, A. H.(Armen H.)-
dc.contributor.otherPreservation Department, Stony Brook University Libraries.en_US
dc.contributor.otherCataloging & Metadata Department, Stony Brook University Libraries.en_US
dc.date.accessioned2007-07-17T16:57:39Z-
dc.date.accessioned2015-04-24T14:27:23Z-
dc.date.available2007-07-17T16:57:39Z-
dc.date.available2015-04-24T14:27:23Z-
dc.date.issued1988en_US
dc.identifier.urihttp://hdl.handle.net/1951/37237-
dc.identifier.urihttp://hdl.handle.net/11401/65471-
dc.descriptionleave(s) : ill; 28 cm.en_US
dc.formatMonograph.en_US
dc.format.extent242637 bytes-
dc.format.mediumElectronic Resource.en_US
dc.format.mimetypeapplication/pdf-
dc.language.isoen_US-
dc.publisherStony Brook, N.Y.: State University of New York at Stony Brook, College of Engineering.en_US
dc.publisherStony Brook University.en_US
dc.rightsAll Rights Reserved. Stony Brook University.en_US
dc.subject.lcshLC Subject Here.en_US
dc.subject.otherKeywords here.en_US
dc.titleGround bounce effects in dielectric and substrate coupling between IC interconnectsen_US
dc.typeTechnical Reporten_US
dc.description.contributorThe content contained herein is maintained and curated by the Preservation Department.en_US
dc.description.contributorThis record is revised and maintained by the content administrators from the Cataloging & Metadata Department.en_US
dc.publisher.locationStony Brook, NY.en_US
Appears in Collections:Community Members' Scholarship [CEAS]

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